J-form is Build Smart’s proprietary Frost-protected shallow foundation system. J-form makes it unnecessary to form and pour frost footings. Insulation and air barriers are completely integrated with the E-Wall Building Envelope System. Our J-form allows for condensed construction schedules and superior insulation strategy.
Foundation Insulation System
The J-Form System allows for a new approach to frost protected shallow foundations. The J-Form System takes advantage code provisions and optimizes thermal performance, construction cost and speed. The vertical external leg of the J-form is designed to extend a project’s Continuous External Insulation down over the slab edge.
Combine J-forms with appropriate under-slab insulation, and the building’s concrete footings and floor slab become part of the conditioned envelope. That stops significant heat loss through the exposed slab edge in the winter, and avoids heat gain and condensation/decay/mold at the base of the wall in summertime. Concrete frost footings and stem walls are not required!
Explore J-form system
J-Form foundation insulation system is termite treated NS specially formulated for installation in contact with earth. Pre-formed custom shapes are produced for:
1. Slab on grade by contractor
2. Continuous under-slab Stego Vapor Barrier & Accessories
(available for purchase from Build SMART)
3. J-Form Frost Protected Shallow Foundation Form
High Density Geofoam EPS insulation. Termite treated. Critical slab edge insulation matches R-Value and profile of continuous external insulation employed on Build SMART E-Wall Building Envelope System
4. EPS Filler Piece
Extends continuous external insulation from J-Form to Build SMART E-Wall Building envelope system.
5. Underslab Insulation
(available for purchase from Build SMART)
6. Protective Foundation to Wall Covering
(available for purchase from Build SMART)
7. Compacted gravel bed and foundation drainage by contractor
Extends continuous external insulation from J-Form to Build SMART E-Wall Building envelope system.